iPhone Ultra, Apple’s first book-style foldable, will feature a redesigned internal layout, according to the leaked images of the phone’s motherboard. The image of the phone’s motherboard shows the unreleased Apple Silicon A20 Pro chipset placed next to the DRAM, instead of being stacked on top of the chip. The A20 Pro chip and DRAM of the iPhone Ultra will reportedly be connected via a redistribution layer. Usually, the SoC and DRAM are stacked on top of each other with a conventional interposer. The redistribution layer is said to eliminate the need for an additional silicon interposer, as found on traditional designs, as it is built right into the package. This will reportedly help the foldable offer improved thermal performance.
